Johanson Expands High-Q Multilayer Product Family with the New C-Series
Johanson is proud to announce the new C-Series High Frequency Multilayer Ceramic Capacitors. These ultra-low loss capacitors are made with Copper electrodes, instead of Palladium and Silver, making them less subject to the price volatility of precious metals. Therefore, prices for these low ESR capacitors will be more stable over time. Available in three cases sizes (0402, 0603, 0805), this series features an enhanced ESR of over 1.5GHz, and was developed with two key design criteria – reliability and lot-to-lot RF consistency. Applications include low power RF, smart metering, RF remote control, broadband wireless equipment, cellular base station equipment, RF matching and filter networks and RF microwave test equipment.
For a specification sheet, please contact Cover 2 Sales.
SV Microwave’s high-frequency SMA connectors and cable assemblies offer excellent electrical performance from DC to 27.5 GHz. Review their popular SMA product line available in a variety of formats including cable assemblies, solderless PCB connectors and more. Shop here:
About SV Microwave:
SV Microwave is a world leader in the RF/Microwave industry with over 50 years of proven performance for the military, satellite, aerospace, commercial, industrial, and telecommunications markets.
When it comes to the design and manufacture of high frequency, high-reliability interconnects, SV Microwave has set the standard in RF and microwave connectors, adapters, components, and cable assemblies.
Why Try an EESeal EMI Filter Insert?
There are countless options out there for mitigating EMI issues and helping your product achieve compliance. What sets the EESeal apart? To start:
- Easily installed in 30 seconds without special tools
- Lightweight and virtually invisible, the EESeal saves space and money over bulky adapters and filtered connectors
- Made of a super-resilient material similar to what is used in the interface of high-reliability, ruggedized military connectors
- Maintains the environmental seal to the host connector
- Withstands harsh environments for MIL-STD-461 and DO-160 C conditions, including vibration, shock, salt-spray, and thermal-cycling
The following article was originally written by James Tabbi, Deputy Vice President for Exxelia’s Magnetics Business Unit
Exxelia recently designed an auxiliary transformer for a spacecraft application, where interwinding capacitance was of concern to the customer. The controller chip they were using in their power supply was noted to be “rather sensitive to excess capacitance.”
Exxelia has also supplied thousands of driver transformers for use in a subsystem of the AN/TPQ-53 Radar System in which interwinding capacitance within the toroidal windings is held to a very demanding tolerance.
But what IS interwinding capacitance?
Capacitance in a transformer winding cannot be avoided. The voltage difference between turns, between winding layers and from windings to the core, creates “parasitic” capacitances in the transformer circuit. These capacitances are shown as Cp, Cs, and Cw in this schematic diagram of an electronic transformer “equivalent circuit.”
Interwinding and distributed capacitance occur in transformers due to the physical separation of, and electrostatic coupling between, different turns of wire. In general, the capacitance presents itself between the different layers within a winding and between the outside layer of one winding and the inside layer of the next.
In conventional magnetics, interwinding capacitance is a function of coil configuration – the geometry of adjacent conductors and separating dielectric media. Specifically, it is directly proportional to the shared surface area of the windings (shown in green and red below), the dielectric constant of the insulator between the windings (shown in gray below), and is inversely proportional to the separation distance through the dielectric media.
In high-frequency transformer design, leakage inductance and capacitance are often competing design requirements since the beneficial parameters that provide low leakage inductance also tend to increase the interwinding capacitance.
Excessive capacitance can cause undesirable common-mode noise transmission between transformer windings or between transformer windings and core or another ground connection.
Exxelia can assist with these design challenges when creating products that have to deal with interwinding capacitance, for all types of magnetic components.
Important coil configuration design considerations must be made when capacitive coupling causes unacceptable signal transmission (for example, common-mode noise transmission or undesirable spurious ringing on a high voltage output). Windings may be configured in a way that reduces the dV/dt voltages induced across dielectric media. Conductive screen(s) tied to preferred potential(s) can also be added between adjacent windings to reduce transmission.
If you’d like to learn more about interwinding capacitance or would like to discuss your specific magnetics needs with Exxelia, please contact Cover 2 Sales to arrange a call with an Exxelia engineer.
Recently, Boyd Corporation published a technical article in Electronics Cooling Magazine. This article covered innovative Ultra-Thin Vapor Chambers (UTVC’s) and how they enable new generations of Mobile, Portable, and Wearable devices and with a competitive advantage in the marketplace. As mobile devices advance it is vital to understand how new, thinner, more powerful cooling technologies are essential to continued industry growth and better performance.
The trend of improved thermal management in thinner and lighter form factors is not a trend relegated to just mobile devices, It is pervasive across all major industries. As part of Boyd’s dedication to forward-thinking and keeping our customers well-informed, this article gives a good foundation on these emerging thermal technologies that are solving challenges in new industries
In addition to this white paper, Boyd has publizhed technical details on TiVC’s in this datasheet.
If you have any questions on UTVC’s or other thermal technologies, please contact Cover 2 Sales. We can set up a a technical discussion with one Boyd’s engineers to discuss how to best address your thermal challenges.