20/08/2020 by cover2sales 0 Comments
Webinar: Unique Board Level EMI Shields Save Space, Lower Profile and Reduce Weight
EMC Live On-Line Seminar
Including a Presentation from XGR Technologies
"Space-Saving Board Level EMI Shielding"
Announcing "EMC Live" – an exciting online event scheduled to take place on September 1, 2020. This is a one-day webinar event focused on IoT, Wireless and 5G EMC. Lean more about EMC Live here.
XGR Technologies will be one of the presenters, delivering a 20-minute webinar on an innovating EMI shielding solution that delivers reduced board space, lighter weight and lower in profile.
XGR Technologies’ presentation will begin at 1:45PM EDT. You can register for their seminar with the following link:
XGR’s presentation will demonstrate how a unique board level EMI shield can enable the board designer to save up to 75% in board space in the trace width around the shielded cavity perimeter. In addition to space savings around the perimeter, you will learn how non-traditional choices in material selection can result in the lowest profile, lightest weight board level shield technology in the market.
XGR Teechnologies is the manfuacturer of the Snapshot® EMI Shielding technology. Originally developed by W.L. Gore & Associates, the SnapShot products are manufactured by XGR using the same materials on the same equipment by the same people that have been making SnapShot parts for the past 15 years.
For more information about XGR Technologies, the SnapShot solution or solving EMI problems, please contact Cover 2 Sales.